Electroplating requires a low-voltage high current power supply to the electroplating tank and an electrolytic device composed of electroplating solution, parts to be plated (cathode) and anode. The composition of the electroplating solution varies according to the coating, but it contains the main salt that provides metal ions, a complexing agent that can complex the metal ions in the main salt to form a complex, and a buffer for stabilizing the pH of the solution.
Anode activator and special additives. Electroplating is a process in which the metal ions in the plating solution are reduced to metal atoms by electrode reaction under the action of external electric field, and the metal is deposited on the cathode. Therefore, this is a metal electrodeposition process including liquid phase mass transfer, electrochemical reaction and electrocrystallization.
In the plating bath containing the plating solution, the cleaned and specially pretreated parts to be plated are used as the cathode, and the anode is made of plated metal. The two poles are respectively connected with the positive and negative poles of the DC power supply. The electroplating solution is composed of an aqueous solution containing compounds of plated metal, conductive salts, buffers, pH regulators, additives, etc.
