Generally, it includes three stages: pretreatment before electroplating, electroplating and post plating treatment. Complete process:
（1.） Pickling → copper plating on the whole board → pattern transfer → acid degreasing → secondary countercurrent rinsing → micro etching → secondary pickling → tin plating → secondary countercurrent rinsing
（2.） Countercurrent rinsing → pickling → graphic copper plating → secondary countercurrent rinsing → nickel plating → secondary water washing → citric acid pickling → gold plating → recycling → 2-3 levels of pure water washing → drying
